PRODUCTION PROCESSES

  • Direct plating in the TOPCOM - ENTHONE-OMI process
  • Layout with the photo and silk-screen method
  • Solder mask with curtain and silk screen method
  • Reference print with silk screen method
  • Lead-free coating in the HAL process
  • Electroless and electrolytic Nickel/Gold plating
  • Immersion tin
  • Carbon paste on contact fields
  • Drilling and routing
  • Scoring
  • Routing in the technological panel
  • Automatic Optical Inspection (AOI)
  • Electrical testing

LIMIT PROCESS VALUES

  Limit process values Photoresist / Silk screen
[mm]
a Minimum distance of conductor from board edge 0.5
b Minimum distance between tracks 0.15/0.20
c Minimum track width 0.12/0.20
d Minimum distance between track and solder pad 0.2
e Minimum width of PTH land 0.15
f Drilled hole diameter 0.35 ÷ 6.5
g Minimum distance between solder pads 0.2
h Clearance between solder mask and pad 0.1
i Minimum land width in internal layers 0.2
j Minimum distance of insulated land from PTH in internal layers 0.4
k Minimum width of electrical junction in the "thermal" type pads 0.2
l Minimum distance of conductor insulation from PTH in the "thermal" and "donut" pads 0.2
m Minimum insulation width in the "thermal" and "donut" pads 0.2
n Minimum width of the masked area 0.15
  Reference print line width 0.2 ÷ 0.3
  Maximum number of conductor layers 20
UNDERWRITERS LABORATORIES INC.
  • Minimum track width at the 0,40 mm distance from board edge - 0,305 mm;
  • Minimum track width at the over 0,40 mm distance from board edge - 0,152 mm;
  • Maximum size of a continuous field - diameter of the incircle - 25,40 mm;
  • Maximum working temperature of the board on assembling into the final product - 120°C.

 

Standard panels used in double-sided PCBs production in ELDOS Ltd.

Standard production panel size
[mm]

Standard fill-in field size
[mm]

Total fill-in surface
[dm2]

340 x 450

310 x 420

13,0

340 x 576

310 x 546

16,9

340 x 610

310 x 580

18,0

355 x 576

325 x 546

17,7

355 x 610

325 x 580

18,9

457 x 610

427 x 580

24,8

 

For production we utilise high-quality imported materials and chemicals.

LAMINATES USED
  • FR-2,
  • FR-3,
  • FR-4,
  • CEM-1
MAIN SUPPLIERS
  • ISOLA AG, Germany
  • PIAD, Italy
  • MATSUSHITA Electric Works, Austria

 

EQUIPMENT

  • Ucam, FixGenius Systems from ManiaTechnologie
  • CAM-350 Systems from DownStreamTechnologies

Belgium, Germany
USA
  • Laser Photoploter, SilverWriter from BARCO
 Belgium
  • CNC EXCELLON drillers with automatic loading and unloading
 USA
  • TOPCOM horizontal line for direct plating from Höllmüller
 Germany
  • DYNACHEM Exposure Unit
  • Phast Print Exposure Unit

Belgium
Germany
  • MORTON Cut-sheet Laminator
 Germany
  • Galvanic line from STS
 Switzerland
  • Curtain coating line for solder mask PROBIMER 150
 Germany
  • BÜRKLE Presses for multilayer boards
 Germany
  • PENTA 550 HAL Unit for plating PCBs with solder alloy
 Poland
  • PILL Immersion tin plating line in the horizontal STANNATECH process
 Germany
  • Nickel and gold plating line
 Poland
  • EXCELLON drillers-routers
 Germany
  • Scoring machine RM 601 SCHMOLL
  • Scoring machine SL13.9 TELMEC
 Germany
Italy
  • MANIA Testers for electrical tests - single and double sided, ECONO TOWER, SPEEDY
 Germany
  • AOI Tester ARGOS 8008
 Germany
  • Registration System for Multilayers from PRINTPROCESS (Targomat III, Rivolino I, Targomill II)
 Switzerland
  • Waste water treatment plant
 Germany